Printed circuit board assembly

Printed circuit board assembly including SMT assembly and DIP soldering (through hole PCB assembly). We have five automatic SMT technology production lines with a production capacity exceeding 200,000 components per hour, equipped with cutting-edge technologies, such as Screen Printer and the latest pick &place machines, X-ray inspection machines and Automatic optical inspection machines. The reflow ovens for SMT soldering work have more than 12 heating zones. We have three DIP production lines and work with selective soldering and wave soldering. All Treepcb equipments follow ROHS directive which restricts the use of hazardous substances including lead-free.
Also you have options to assemble your item with semi-automatic pick & place machines.
•SMT and Through-Hole Assembly
•Fine Pitch Placement
•RoHS Compliance Assembly
•QFN and BGA Assembly
•Prototype & Turn-Key PCB Assembly
•BGA X-Ray Inspection
•Low Volume PCB Assembly
•Min PCB size: 50x50mm
•Min component: 01005
•Component max height: 25mm
•Min lead pitch: 0.3mm
•Min BGA ball pitch: 0.4mm
•Placement precision: +/- 0.03mm
•Custom steel stencil
•Supply Resistor: 0201 0402 0603 0805 series
•Supply Capacitor: 0201 0402 0603 0805 series
•Laser cut for Stencil manufacture for manual, semi-automatic and full automatic solder print machine, the accuracy can be 5 um.

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Send us the following information for a precise quote:
• Assembly drawing
• Bill of Material
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PCB Projects

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DM81x video SOC, DaVinci
Interface: CAN, Ethernet, I2C, McASP, McBSP, MMC / SD, SPI, UART, USB
Operating frequency: 750MHz, 1GHz ARM
Non-volatile memory: ROM (48 kB)
On-chip RAM: 832kB
Voltage – I / O: 1.5V, 1.8V, 3.3V
Voltage – Core: 1.15V
Operating temperature: 0 ° C ~ 90 ° C
footprint / package: 684-BFBGA, FCBGA